Dr Davor Sutija

Biography

Dr. Davor Sutija is CEO of Thin Film Electronics ASA. Prior to joining Thinfilm in January 2010, he was Senior Vice President, Product Marketing, at FAST (a Microsoft subsidiary) and founding CEO at SiNOR AS, a producer of electronic and PV-grade silicon ingots.

He was a board member for the Organic Electronics Association (OE-A) from 2012 through 2015, and has also served on the BoD of technology firms SensoNor, Birdstep, and Owera. He is currently a member of the Orbotech Advisory Board.

Dr. Sutija is a highly sought-after speaker and presents around the globe on topics including the Internet of Things, the convergence of the physical and digital worlds, and the future of smart packaging. He was a keynote speaker at Mobile World Congress 2015.  Dr. Sutija graduated from the Jerome Fisher Management and Technology program at the Wharton School, and has a Ph.D. from the University of California, Berkeley, in Chemical Engineering. He was a Hertz Fellow at Lawrence Berkeley Labs.

 

Abstract

Roll-based Manufacturing of NFC devices scaled to the Billions of Units enabling the Internet of Everything

The ubiquity of near-field communication (NFC) wireless protocol on smartphones creates an opportunity to add NFC-readable passive tags to disposable objects and packaging.   Ultra-scale manufacturing of NFC circuitry on flexible substrates improves its shock-resistance and tolerance to shear and enables a variety of use cases, ranging from proximity marketing to secure delivery verification by consumers.  By substituting printing for ion implantation, and rapid thermal processing for traditional annealing, electrical components and circuits containing up to thousands of transistors have been made using roll-compatible manufacturing steps.  Millions of such printed NFC tags are currently in market, and starting in 2018, production will scale using a roll-based line to over seven billions of units annually.  A new paradigm in large-area manufacturing is here, with up to a 100x lower capex per front-end die than traditional lithographic bulk-silicon processing.

 

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