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Printed Electronics Insights: Smart Packaging and IoT

11 October 2017 - 12 October 2017

| £250

Attend a day full of presentations and discussions by experts in the field of printed electronics on October 12, in Cambridge (UK).

Together with the OE-A, the EPSRC Centre for Innovative Manufacturing in Large-Area Electronics  is organizing “Printed Electronics Insights: Smart Packaging & IoT”, a day of presentations and a panel discussion, co-sponsored by FlexTech. The event will be held on Thursday, October 12, 2017 at Robinson College, Cambridge (UK), with company tours and a networking reception on the day before, joining participants of the 41st OE-A Working Group Meeting (Oct. 10-11, 2017).

Inspired by a keynote on machine learning by Christopher Williams, Chief Architect for IBM Watson Europe, attendees will learn more on IoT and its application in Smart Packaging in presentations ranging from experiences of packaging companies to the latest innovations from academia.

We are proud to have Professor Sir Richard Friend, FRS, FREng, as dinner speaker at the networking reception on October 11. Further details of the programme are given below.

Registration is now open. OE-A and FlexTech members will receive a discount on ticket prices.

Ticket prices:

  • £250
  • £100 (OE-A members, FlexTech members)

For questions, please contact daria.firlus@oe-a.org

Preliminary Programme

Wednesday October 11 2017
16.30New delegates: Registration at Maxwell Centre
16.30OE-A Working Group delegates: Walk from Robinson College to Maxwell Centre
17.00Tours of Maxwell Centre, University of Cambridge and CDT Company Exhibition
19.00Networking Reception & Dinner at Robinson College
Dinner speech:
Organic Electronics – what are the limits to performance?
Prof. Sir Richard Friend, FRS, FREng

  • Organic semiconductors offer convenient and cheap large area processing, but maybe at the expense of ultimate semiconductor performance?
  • OLEDs have achieved high efficiencies and large market penetration.
  • What does the underlying semiconductor science tell us about the prospects for OFETs and organic solar cells?
Thursday October 12 2017
Dr Jeremy Burroughes, Cambridge Display Technology
9:35The understanding Internet of Things

Christopher Williams, IBM Watson
In the session I will talk about how Augmented Intelligence allows machines to understand human language and recognise images in order to deliver better outcomes and user experiences. I will explore how connecting this intelligence to smart devices and infrastructure can provide new levels of control and information.
Chris Williams is IBM Watson's Chief Architect in Europe. He works with IBM's clients across many industries to deliver innovative solutions that use the Cognitive power of the IBM Watson platform. Chris joined IBM Watson when it was started as a commercial organisation in 2014. Prior to that he spent many years working in Big Data, Analytics and Business Intelligence. Chris is a Fellow of the British Computer Society
Session: Smart Packaging in Mass Applications
Moderation: Dr Klaus Hecker, Managing Director, OE-A
10:00Smart packaging for the mass market

Scott White, PragmatIC

  • Electronics reinvented for trillions of things
  • Applications in smart packaging
  • Scaling for the future
10:25Fuelling the Internet of Everything Through Printed Electronics Technology and Scaled Roll-to-Roll Manufacturing

Dr Torbjörn Eriksson, Thin Film Electronics

  • Introduction to Thinfilm and Thinfilms products
  • Description of global deployment
  • Benefits
  • Next steps
10:50Intelligent Packaging using printed electronics on paper

Dr Gaël Depres, Arjowiggins
Arjowiggins launched a range of NFC papers, named Powercoat Alive, with a printed NFC antenna with an unpackaged chip hidden inside the bulk of the paper. Intelligent packaging, business cards, invitations, security documents and labels are then ready to be graphically printed. The next step is to have different sensors, like temperature, pressure, bending or just opening. Such smart papers can also be incorporated in injection molded systems or composites. Other frequency systems, like Bluetooth, are under development.
11:15Coffee Break
Session: Smart packaging in clinical applications
Moderation: Dr Luigi Occhipinti, University of Cambridge
11:35Printed technology aiding in the multi-billion adherence problem

Jesper Hassel, Mevia

  • What is adherence to medication and why is it important
  • How Mevia uses printed inks with a combination of electronics and inks.
  • Results and learnings from tests with users
12:00Smart Label for Environmental Sensing in Clinical Trials Distribution

Dr Simon Johnson, CPI

  • Smart label specification
  • Design and technology of the label
  • Label performance
12:25MyWare – a smart packaging concept for Pharmaceutical and Medical Applications

Wolfgang Mildner, MSWtech

  • enabling direct patient information and compliance
  • providing unique identification and user interaction
  • open concept using printed and hybrid electronics (e.g. NFC, Beacon) connecting packaging to the web
  • application examples will be demonstrated
Roundtable panel discussion
14:00Smart Packaging: changing perspectives, interlinking ideas
Dr Luigi Occhipinti, University of Cambridge
Session: New technologies Smart Packaging
Moderation: Dr Ilaria Grizzi, Cambridge Display Technology Ltd
14:30Towards a Flexible Power Module for the IoT

Dr Simon King, Cambridge Display Technology

  • Both Smart Packaging and many IoT applications will require the development of a new generation of thin and flexible power sources. In addition to flexible energy storage, the use of energy harvesting will be required to circumvent the need for labour intensive battery replacement.
  • To address these needs CDT is working on a number of projects in flexible energy harvesting and storage, including printable thermoelectrics, flexible batteries and organic photovoltaics. We will present our recent technological advancements in these fields.
  • We will discuss the power requirements of some applications within the IoT and how they impact on the energy harvesting system design. This will demonstrate the importance of application specific technology development in this very broad area.
14:55Flexible oxide electronics: current status and applications

Prof. Pedro Barquinha, CENIMAT

  • How are oxide semiconductors outpacing conventional organic and a-Si:H semiconductors as materials for thin-film transistors exhibiting high mobility (>5 cm2/Vs) at low processing temperature (< 200 ºC)
  • The existence of sustainable materials and processes for large area oxide electronics: the example of zinc-tin oxide and solution processing
  • Applications: digital and analog blocks (e.g., temperature and electrical stress tolerant circuits, high-gain amplifiers and multipliers) and systems (e.g., smart bottles, flexible x-ray sensors).
  • Short-channel and NW-based oxide electronics for >MHz operation
15:20Active and intelligent packaging - building blocks towards scale up

Prof. Jukka Hast, VTT

  • Functional solutions for interactive packaging
  • Printed and hybrid electronics for intelligent packaging
  • Examples of active and intelligent packaging
  • R2R pilot manufacturing environment for the active and intelligent packaging
Closing Remarks
15:45Dr Jeremy Burroughes, Cambridge Display Technology


The programmes on both the 11th and 12th of October take place at locations found along the Universal bus route. This bus service links the train station with Robinson College, the West Cambridge site, Maxwell Centre, and Eddington Avenue (a stop near the Madingley Park and Ride). This means that whether you are driving to the Madingley Park and Ride, or arriving by train, this will be a convenient bus service for you.

Explore the Universal bus route, here. 

Note that if you are going to park at the Park and Ride, you can then walk to the Maxwell Centre at the West Cambridge site. If you would like to use the Universal bus, it will not come to the Park and Ride, but you can use the gate in the north east corner of the car park to reach the Universal bus stops on Eddington Avenue - see map.

A £2 flat fare applies and University card holders pay just £1 for a single journey. Unlimited travel is just £3 a day and £10 a week.  All tickets are available from the driver (cash only please). For Universal bus times, see the timetable.







Locally Supported by


11 October 2017
12 October 2017
Event Category:


OE-A and EPSRC Centre for Innovative Manufacturing in Large-Area Electronics


Robinson College
Grange Road
Cambridge,CB3 9ANUnited Kingdom
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