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Printed Electronics Insights: Smart Packaging and IoT

October 12 2017

| £250

Attend a day full of presentations and discussions by experts in the field of printed electronics on October 12, in Cambridge (UK).

Together with the OE-A, the EPSRC Centre for Innovative Manufacturing in Large-Area Electronics  is organizing “Printed Electronics Insights: Smart Packaging & IoT”, a day of presentations and a panel discussion, co-sponsored by FlexTech. The event will be held on Thursday, October 12, 2017 at Robinson College, Cambridge (UK), with company tours and a networking reception on the day before, joining participants of the 41st OE-A Working Group Meeting (Oct. 11, 2017).

Inspired by a keynote on machine learning by Christopher Williams, Chief Architect for IBM Watson Europe, attendees will learn more on IoT and its application in Smart Packaging in presentations ranging from experiences of packaging companies to the latest innovations from academia.

We are proud to have Professor Sir Richard Friend, FRS, FREng, as dinner speaker at the networking reception on October 11. Furthermore, you can expect presentations by various renowned experts from international companies and research institutes such as PragmatIC, Crown Packaging, VTT and CDT.

The finalized program will be available soon.

Registration
Registration is now open. OE-A and FlexTech members will receive a discount on ticket prices.

Ticket prices:

  • £250
  • £100 (OE-A members, FlexTech members)

For questions, please contact daria.firlus@oe-a.org

Programme
Wednesday October 11 2017

  • Company tours
  • Networking Event

Thursday October 12 2017

  • One-day conference

Organizer

Organizer

Co-sponsor

Co-sponsor

Details

Date:
October 12 2017
Cost:
£250
Event Category:

Venue

Robinson College
Grange Road
Cambridge, CB3 9AN United Kingdom
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Website:
robinson.cam.ac.uk