Attend a day full of presentations and discussions by experts in the field of printed electronics on October 12, in Cambridge (UK).
Together with the OE-A, the EPSRC Centre for Innovative Manufacturing in Large-Area Electronics is organizing “Printed Electronics Insights: Smart Packaging & IoT”, a day of presentations and a panel discussion, co-sponsored by FlexTech. The event will be held on Thursday, October 12, 2017 at Robinson College, Cambridge (UK), with company tours and a networking reception on the day before, joining participants of the 41st OE-A Working Group Meeting (Oct. 10-11, 2017).
Inspired by a keynote on machine learning by Christopher Williams, Chief Architect for IBM Watson Europe, attendees will learn more on IoT and its application in Smart Packaging in presentations ranging from experiences of packaging companies to the latest innovations from academia.
We are proud to have Professor Sir Richard Friend, FRS, FREng, as dinner speaker at the networking reception on October 11. Further details of the programme are given below.
Registration is now open. OE-A and FlexTech members will receive a discount on ticket prices.
- £100 (OE-A members, FlexTech members)
For questions, please contact firstname.lastname@example.org
|Wednesday October 11 2017|
|16.30||New delegates: Registration at Maxwell Centre|
|16.30||OE-A Working Group delegates: Walk from Robinson College to Maxwell Centre|
|17.00||Tours of Maxwell Centre, University of Cambridge and CDT Company Exhibition|
|19.00||Networking Reception & Dinner at Robinson College|
Organic Electronics – what are the limits to performance?
Prof. Sir Richard Friend, FRS, FREng
|Thursday October 12 2017|
Dr Jeremy Burroughes, Cambridge Display Technology
|9:35||The understanding Internet of Things|
Christopher Williams, IBM Watson
In the session I will talk about how Augmented Intelligence allows machines to understand human language and recognise images in order to deliver better outcomes and user experiences. I will explore how connecting this intelligence to smart devices and infrastructure can provide new levels of control and information.
Chris Williams is IBM Watson's Chief Architect in Europe. He works with IBM's clients across many industries to deliver innovative solutions that use the Cognitive power of the IBM Watson platform. Chris joined IBM Watson when it was started as a commercial organisation in 2014. Prior to that he spent many years working in Big Data, Analytics and Business Intelligence. Chris is a Fellow of the British Computer Society
|Session: Smart Packaging in Mass Applications|
Moderation: Dr Klaus Hecker, Managing Director, OE-A
|10:00||Smart packaging for the mass market|
Scott White, PragmatIC
|10:25||Fuelling the Internet of Everything Through Printed Electronics Technology and Scaled Roll-to-Roll Manufacturing|
Dr Torbjörn Eriksson, Thin Film Electronics
|10:50||Intelligent Packaging using printed electronics on paper|
Dr Gaël Depres, Arjowiggins
Arjowiggins launched a range of NFC papers, named Powercoat Alive, with a printed NFC antenna with an unpackaged chip hidden inside the bulk of the paper. Intelligent packaging, business cards, invitations, security documents and labels are then ready to be graphically printed. The next step is to have different sensors, like temperature, pressure, bending or just opening. Such smart papers can also be incorporated in injection molded systems or composites. Other frequency systems, like Bluetooth, are under development.
|Session: Smart packaging in clinical applications|
Moderation: Dr Luigi Occhipinti, University of Cambridge
|11:35||Printed technology aiding in the multi-billion adherence problem|
Jesper Hassel, Mevia
|12:00||Smart Label for Environmental Sensing in Clinical Trials Distribution|
Dr Simon Johnson, CPI
|12:25||MyWare – a smart packaging concept for Pharmaceutical and Medical Applications|
Wolfgang Mildner, MSWtech
|Roundtable panel discussion|
|14:00||Smart Packaging: changing perspectives, interlinking ideas|
Dr Luigi Occhipinti, University of Cambridge
|Session: New technologies Smart Packaging|
Moderation: Dr Ilaria Grizzi, Cambridge Display Technology Ltd
|14:30||Towards a Flexible Power Module for the IoT|
Dr Simon King, Cambridge Display Technology
|14:55||Flexible oxide electronics: current status and applications|
Prof. Pedro Barquinha, CENIMAT
|15:20||Active and intelligent packaging - building blocks towards scale up|
Prof. Jukka Hast, VTT
|15:45||Dr Jeremy Burroughes, Cambridge Display Technology|
The programmes on both the 11th and 12th of October take place at locations found along the Universal bus route. This bus service links the train station with Robinson College, the West Cambridge site, Maxwell Centre, and Eddington Avenue (a stop near the Madingley Park and Ride). This means that whether you are driving to the Madingley Park and Ride, or arriving by train, this will be a convenient bus service for you.
Explore the Universal bus route, here.
Note that if you are going to park at the Park and Ride, you can then walk to the Maxwell Centre at the West Cambridge site. If you would like to use the Universal bus, it will not come to the Park and Ride, but you can use the gate in the north east corner of the car park to reach the Universal bus stops on Eddington Avenue - see map.
A £2 flat fare applies and University card holders pay just £1 for a single journey. Unlimited travel is just £3 a day and £10 a week. All tickets are available from the driver (cash only please). For Universal bus times, see the timetable.