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The 4th annual Innovations in Large-Area Electronics Conference (innoLAE 2018) will be held at the Wellcome Genome Campus Conference Centre in Hinxton, Cambridge, UK on 23-24 January 2018. The conference programme highlights the most innovative and exciting aspects of large-area electronics (including printable, flexible or organic electronics) emerging technologies, their manufacture and the development of products incorporating large-area electronics. Through innoLAE, we provide a platform to help bring innovation into the market and accelerate take up of new technologies.Find out more »
An invitation-only workshop on September 12 2017 for potential end users and industry partners at which we will present our recent technology progress on bonding of silicon to flex and flex-to-flex circuits and discuss a proposed new approach to foil-to-foil integration for smart systems.Find out more »
Attend a day full of presentations and discussions by experts in the field of printed electronics on October 12, in Cambridge (UK) to learn more about IoT and its application in Smart Packaging in presentations ranging from experiences of packaging companies to the latest innovations from academia. The programme includes company tours and a networking reception on the day before. The event is co-organized by the OE-A and co-sponsored by FlexTech.Find out more »
The conference is hosted by the Welsh Centre for Printing and Coating (WCPC) in association with icmPrint Ltd.
The conference is an opportunity to view the latest WCPC research in printing technology, to discuss the findings with researchers and to network with like-minded industrial delegates. Each presentation will be a technical paper based on latest results and analysis derived from controlled experiments and numerical models.