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January 2018
£150 - £300

innoLAE 2018

23 January 2018 - 24 January 2018

The 4th annual Innovations in Large-Area Electronics Conference (innoLAE 2018) will be held at the Wellcome Genome Campus Conference Centre in Hinxton, Cambridge, UK on 23-24 January 2018. The conference programme highlights the most innovative and exciting aspects of large-area electronics (including printable, flexible or organic electronics) emerging technologies, their manufacture and the development of products incorporating large-area electronics. Through innoLAE, we provide a platform to help bring innovation into the market and accelerate take up of new technologies.

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September 2017

Hybrid flexible electronics manufacturing: new approaches to production of flexible smart systems

September 12 2017
Imperial College London, South Kensington Campus
London, SW7 2AZ United Kingdom
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An invitation-only workshop  on September 12 2017 for potential end users and industry partners at which we will present our recent technology progress on bonding of silicon to flex and flex-to-flex circuits and discuss a proposed new approach to foil-to-foil integration for smart systems.

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October 2017
£250

Printed Electronics Insights: Smart Packaging and IoT

October 12 2017
Robinson College, Grange Road
Cambridge, CB3 9AN United Kingdom
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Attend a day full of presentations and discussions by experts in the field of printed electronics on October 12, in Cambridge (UK) to learn more about IoT and its application in Smart Packaging in presentations ranging from experiences of packaging companies to the latest innovations from academia. The programme includes company tours and a networking reception on the day before. The event is co-organized by the OE-A and co-sponsored by FlexTech.

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November 2017
£300 - £450

Welsh Centre for Printing and Coating (WCPC) Annual Technical Conference and Exhibition 2017

November 6 2017 - November 7 2017
Swansea Marriott Hotel, Swansea, SA1 3SS United Kingdom + Google Map

The conference is hosted by the Welsh Centre for Printing and Coating (WCPC) in association with icmPrint Ltd.
The conference is an opportunity to view the latest WCPC research in printing technology, to discuss the findings with researchers and to network with like-minded industrial delegates. Each presentation will be a technical paper based on latest results and analysis derived from controlled experiments and numerical models.

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