Printed Electronics Insights: Smart Packaging and IoT

We invite you to attend "Printed Electronics Insights: Smart Packaging and IoTat Robinson College, Cambridge, UK on October 11-12, 2017 where you will learn more about the Internet of Things and its application in Smart Packaging through presentations ranging from the experiences of packaging companies to the latest innovations from academia.

The event starts on October 11 with a tour and company exhibition followed by a networking reception and dinner where the speaker will be Prof. Sir Richard Friend. On October 12 there will be a full day of talks and panel discussions from leading experts in printed electronics including contributors from PragmatIC, Thin Film Electronics, Arjowiggins, Mevia, CPI, Cambridge Display Technology, CENIMAT and VTT.

Topics covered will include:

  • Smart packaging for mass markets
  • Fuelling the Internet of Everything through printed electronics
  • Electronics on paper
  • Smart Labels for environmental sensing
  • Flexible Power for the IoT
  • Scaling up active and intelligent packaging

The keynote address will be given by Christopher Williams from IBM Watson who will talk about how Augmented Intelligence allows machines to understand human language and recognise images in order to deliver better outcomes and user experiences and explore how connecting this intelligence to smart devices and infrastructure can provide new levels of control and information.

For more details of the talks, please visit the event web page.

You can register for the event: here

The event is co-organized with the Organic Electronics Association (OE-A) and follows the 41st OE-A Working Group Meeting (Oct. 10-11, 2017) also being held in Cambridge.  It is co-sponsored by FlexTech. Members of OE-A and FlexTech are eligible for a discounted registration rate. 

Preliminary Programme

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